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Technology
The Technology Transfer and Partnerships Office
Area of Expertise
empty Industrial Processes

As GRC scientists develop new materials and devices, they also deal with manufacturability issues.  They improve processes for making existing materials and devices, while striving to reduce cost, produce a more uniform and repeatable product, eliminate hazardous materials, and develop continuous processes to replace batch processes.





Technologies Available for Licensing 

GRC patents available for licensing.

Title Description/Abstract
Rocket motor joint construction including thermal barrier + Go to full description
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High temperature seal for large structural movements + Go to full description
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Noncontacting finger seal + Go to full description
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Acoustic Seal + Go to full description
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System for controlling a magnetically levitated rotor + Go to full description
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Bearingless switched reluctance motor + Go to full description
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Large area plasma source + Go to full description
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Slotted antenna waveguide plasma source + Go to full description
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Software for System for Controlling A Magnetically Levitated Rotor + Go to full description
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+ Contact us about these technologies

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 Partnership Opportunities 

No technologies available at this time.

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 Relevant SBIR/STTR Opportunities 

SBIR Subtopic Number Title
A2.01 Materials and Structures for Future Aircraft (link opens new browser window)

+ Contact us about these SBIR opportunities

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 Recent Activities and Articles 

R&T REPORT 2007

+ Download complete 2007 R&T Report

  • Manufacturing Process for Polymer Cross-Linked Aerogel Composites Developed
  • Technology for Integrating Ultra-High-Temperature Ceramic Composites With Metallic Systems Developed
  • Joining of Carbon-Carbon Composites to Metals Demonstrated for Thermal Management Applications
  • Design, Fabrication, and Performance of Open-Source Foil Bearings Demonstrated
  • Electrical Resistance Tested as a Nondestructive Evaluation Technique for Silicon Carbide/Silicon Carbide Composites
  • Microelectromechanical Systems Packaging Technique and Chip Fabrication Method Developed for High-Temperature, Harsh-Environment  Silicon-Carbide Pressure Sensors
  • Silicon Carbide Integrated Circuit Fabricated and Electrically Operated for 2000 hr at 500 C

+ Contact us for more information about these technologies

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 Additional Related Resources 

None at this time

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 Success & Recognition 

SUCCESS STORIES

None at this time

AWARDS

None at this time

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  • Page Last Updated: February 24, 2009
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